Thermal modelling of electronic devices and equipments has been a routine engineering task in modern day design. Circuit boards get increasingly packed due to demand of smaller sizes and faster processing speeds. As a result more heat is generated, and to make things worse, heat dissipation becomes harder. Polaris CFD software has the capability of solving thermal problems in natural and forced convection environment. The details of complex geometry, both at the system-level and at the component level, can be entirely modeled without compromise.
Polaris CFD has an integrated diffusion solver for solving heating transfers inside solid. Heat generated by a component can be transferred to its attached heat sink, and hence dissipated into the air.